Conector de backplane TE Connectivity, Serie Z-PACK HM-Zd, paso 2.5mm, 80 vías, 8 filas, Recta, Macho, Presión

Código de producto RS: 683-1396PMarca: TE ConnectivityNúmero de parte de fabricante: 1469002-1
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Documentos Técnicos

Especificaciones

Conector de panel posterior

4 Pair, High Speed Hard Metric

Género

Male

Número de contactos

80

Número de columnas

10

Número de Filas

8

Orientación del Cuerpo

Straight

Material de la Carcasa

PET

Espaciado

2.5mm

Material del Contacto

Bronce Fosforado

Revestimiento del Contacto

Gold over Nickel

Método de Terminación

Presionar

Serie

Z-PACK HM-Zd

Temperatura máxima de funcionamiento

105.0°C

Temperatura Mínima de Funcionamiento

-65.0°C

País de Origen

United States

Datos del producto

TE Connectivity Z-PACK HM-Zd Plus 4 Pair Receptacle Connector

Z-PACK HM-Zd Plus 80 way 4 pair press-fit board to board receptacle connector for updating connection between daughter card and motherboard through the addition of added ground contacts on the outside pair of the receptacle connector system resulting in enhanced performance and lower cross talk. Integrated pre-alignment features and polarization are built into the mating interface for this Z-PACK HM-Zd Plus connector to ensure secure mating and data rates of up to 15 Gbp/s with a migration plan to 20 Gbp/s can be supported. This Z-PACK HM-Zd Plus 4 pair receptacle connector can also be plugged into existing Z-PACK HM-Zd backplane connectors enabling field speed upgrades, it is also suitable for use with Advanced TCA next-generation applications and specified for Advanced zone 2 requirements. The Z-PACK HM-Zd connector is through hole mounting has a standard module size of 25mm and a 25.40mm card pitch.

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Conector de backplane TE Connectivity, Serie Z-PACK HM-Zd, paso 2.5mm, 80 vías, 8 filas, Recta, Macho, Presión
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P.O.A.

Conector de backplane TE Connectivity, Serie Z-PACK HM-Zd, paso 2.5mm, 80 vías, 8 filas, Recta, Macho, Presión
Volver a intentar más tarde
Seleccionar tipo de embalaje

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more

Documentos Técnicos

Especificaciones

Conector de panel posterior

4 Pair, High Speed Hard Metric

Género

Male

Número de contactos

80

Número de columnas

10

Número de Filas

8

Orientación del Cuerpo

Straight

Material de la Carcasa

PET

Espaciado

2.5mm

Material del Contacto

Bronce Fosforado

Revestimiento del Contacto

Gold over Nickel

Método de Terminación

Presionar

Serie

Z-PACK HM-Zd

Temperatura máxima de funcionamiento

105.0°C

Temperatura Mínima de Funcionamiento

-65.0°C

País de Origen

United States

Datos del producto

TE Connectivity Z-PACK HM-Zd Plus 4 Pair Receptacle Connector

Z-PACK HM-Zd Plus 80 way 4 pair press-fit board to board receptacle connector for updating connection between daughter card and motherboard through the addition of added ground contacts on the outside pair of the receptacle connector system resulting in enhanced performance and lower cross talk. Integrated pre-alignment features and polarization are built into the mating interface for this Z-PACK HM-Zd Plus connector to ensure secure mating and data rates of up to 15 Gbp/s with a migration plan to 20 Gbp/s can be supported. This Z-PACK HM-Zd Plus 4 pair receptacle connector can also be plugged into existing Z-PACK HM-Zd backplane connectors enabling field speed upgrades, it is also suitable for use with Advanced TCA next-generation applications and specified for Advanced zone 2 requirements. The Z-PACK HM-Zd connector is through hole mounting has a standard module size of 25mm and a 25.40mm card pitch.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more