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Documentos Técnicos
Especificaciones
Brand
MolexTipo de Producto
PCB Header
Serie
Micro-Fit 3.0
Paso
3mm
Corriente
5.0
Número de contactos
12
Número de Filas
2
Orientación
Right Angle
Recubierto/Descubierto
Shrouded
Tipo de Montaje
Surface
Connector System
Wire-to-Board
Material de los contactos
Brass
Contacto chapado
Gold
Tipo de terminación
Solder
Tensión
250V
Datos del producto
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Volver a intentar más tarde
$ 39.295
$ 7.859 Each (In a Pack of 5) (Sin IVA)
$ 46.761
$ 9.352,21 Each (In a Pack of 5) (IVA Inc.)
Estándar
5
$ 39.295
$ 7.859 Each (In a Pack of 5) (Sin IVA)
$ 46.761
$ 9.352,21 Each (In a Pack of 5) (IVA Inc.)
Volver a intentar más tarde
Estándar
5
| Cantidad | Precio Unitario sin IVA | Por Pack |
|---|---|---|
| 5 - 95 | $ 7.859 | $ 39.295 |
| 100 - 370 | $ 6.366 | $ 31.830 |
| 375 - 1495 | $ 5.771 | $ 28.855 |
| 1500 - 2995 | $ 5.245 | $ 26.225 |
| 3000+ | $ 5.037 | $ 25.185 |
Documentos Técnicos
Especificaciones
Brand
MolexTipo de Producto
PCB Header
Serie
Micro-Fit 3.0
Paso
3mm
Corriente
5.0
Número de contactos
12
Número de Filas
2
Orientación
Right Angle
Recubierto/Descubierto
Shrouded
Tipo de Montaje
Surface
Connector System
Wire-to-Board
Material de los contactos
Brass
Contacto chapado
Gold
Tipo de terminación
Solder
Tensión
250V
Datos del producto
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals