Documentos Técnicos
Especificaciones
Brand
TE ConnectivityConector de panel posterior
4 Pair, High Speed Hard Metric
Género
Male
Número de contactos
80
Número de columnas
10
Número de Filas
8
Orientación del Cuerpo
Straight
Material de la Carcasa
PET
Espaciado
2.5mm
Material del Contacto
Bronce Fosforado
Revestimiento del Contacto
Gold over Nickel
Método de Terminación
Presionar
Serie
Z-PACK HM-Zd
Temperatura Máxima de Operación
105.0°C
Temperatura de Funcionamiento Mínima
-65.0°C
País de Origen
United States
Datos del producto
TE Connectivity Z-PACK HM-Zd Plus 4 Pair Receptacle Connector
Z-PACK HM-Zd Plus 80 way 4 pair press-fit board to board receptacle connector for updating connection between daughter card and motherboard through the addition of added ground contacts on the outside pair of the receptacle connector system resulting in enhanced performance and lower cross talk. Integrated pre-alignment features and polarization are built into the mating interface for this Z-PACK HM-Zd Plus connector to ensure secure mating and data rates of up to 15 Gbp/s with a migration plan to 20 Gbp/s can be supported. This Z-PACK HM-Zd Plus 4 pair receptacle connector can also be plugged into existing Z-PACK HM-Zd backplane connectors enabling field speed upgrades, it is also suitable for use with Advanced TCA next-generation applications and specified for Advanced zone 2 requirements. The Z-PACK HM-Zd connector is through hole mounting has a standard module size of 25mm and a 25.40mm card pitch.
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Documentos Técnicos
Especificaciones
Brand
TE ConnectivityConector de panel posterior
4 Pair, High Speed Hard Metric
Género
Male
Número de contactos
80
Número de columnas
10
Número de Filas
8
Orientación del Cuerpo
Straight
Material de la Carcasa
PET
Espaciado
2.5mm
Material del Contacto
Bronce Fosforado
Revestimiento del Contacto
Gold over Nickel
Método de Terminación
Presionar
Serie
Z-PACK HM-Zd
Temperatura Máxima de Operación
105.0°C
Temperatura de Funcionamiento Mínima
-65.0°C
País de Origen
United States
Datos del producto
TE Connectivity Z-PACK HM-Zd Plus 4 Pair Receptacle Connector
Z-PACK HM-Zd Plus 80 way 4 pair press-fit board to board receptacle connector for updating connection between daughter card and motherboard through the addition of added ground contacts on the outside pair of the receptacle connector system resulting in enhanced performance and lower cross talk. Integrated pre-alignment features and polarization are built into the mating interface for this Z-PACK HM-Zd Plus connector to ensure secure mating and data rates of up to 15 Gbp/s with a migration plan to 20 Gbp/s can be supported. This Z-PACK HM-Zd Plus 4 pair receptacle connector can also be plugged into existing Z-PACK HM-Zd backplane connectors enabling field speed upgrades, it is also suitable for use with Advanced TCA next-generation applications and specified for Advanced zone 2 requirements. The Z-PACK HM-Zd connector is through hole mounting has a standard module size of 25mm and a 25.40mm card pitch.